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BS EN IEC 61189-2-801. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801. Thermal conductivity test for base materials not-eligible possible weak population
BS EN IEC 61189-2-801. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801. Thermal conductivity test for base materials not-eligible possible weak population
$20.00
Description
possible weak population
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From today's perspective
The specification information included in this document is applicable only when the design guidance in PD 6702-1 has been followed
BS EN IEC 61189-2-801. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801. Thermal conductivity test for base materials not-eligible possible weak population
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