Semiconductor devices. Micro-electromechanical devices - Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures Ingestion-build-84997 it is not applicable to

it is not applicable to commercial or work boats used in severe conditions

discovery and integration

related to

Electrical safety of appliances and immunity to electromagnetic phenomena

Fuel production industries

Semiconductor devices. Micro-electromechanical devices - Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures Ingestion-build-84997 it is not applicable to1 Scope This part of IEC 62047 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 m to 1 000 m in the plane direction and from 1 m to 100 m in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 m and 10 m in thickness.