US$ 216.52
Silicon Nitride Film (LPCVD) on Corning 7980, Film thickness: 1.3um ,10x10x0.5mm Tube Blocks 525 mm thickness Si wafer
$48.64
Description
525 mm thickness Si wafer (Prime Grade) with thermal oxide: 300 nm thk
Resistivity: 0
Net weight 50 lbs
Size: 2" Dia x0
300-500A thick Gold coating inside case by plasma sputtering coater
Silicon Nitride Film (LPCVD) on Corning 7980, Film thickness: 1.3um ,10x10x0.5mm Tube Blocks 525 mm thickness Si waferSilicon Nitride Film Si3N4 Film coated by low stress LPCVD method Si3N4 Thickness: 1. 3um + 5% Si3N4 covers both side on Corning 7980 0F fused silica ( Warning: the Si3N4 film may have stressed induced micro cracking resulted from the large difference of thermal expansion coefficient between Si3N4 and SiO2 fused silica ) UV Grade Fused Silica (Corning 0F 7980 HPFS) Size: 10x10x0. 5mm Edge: CNC Ground Surface Quality: 60 40 or beer Non effective Area:
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