Bambu Lab TH Board - H2D esun pla+ filament Thermal Compound (included in kit)
$60.00
Description
Thermal Compound (included in kit)
allowing for printing at up to 550°C without wear on the nozzle hole or tip
Uniform Wire Diameter
Hardened Steel 0
When the object to be scanned has deep pockets
Bambu Lab TH Board - H2D esun pla+ filament Thermal Compound (included in kit)Overview The Toolhead (TH) Board is the main electronic component of the Toolhead ensuring seamless operation of the toolhead's parts like the hotend, extruder, cooling fan, and filament cutter. Installation Learn more about H2D TH Board on Bambu Lab Wiki. In the Box TH Board*1 BT2. 6 8 Screw*4 Compatibility H2D and H2D Laser Product Specifications Materials Circuit board Packaging Size 100*135*45 mm Color Black Packaging Weight 0. 099 kg
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