Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints Ingestion-build-115288 Establishing a procurement system

Establishing a procurement system

This part of BS EN 60974 is applicable to power sources with a thermal cut-out device for manual metal arc welding with limited duty

Delivery documents

They may be used at temperatures up to 200 °C maximum on nickel plated conductors with insulation rated for at least 135 °C

• Hydrogen-embrittlement-relief heat treatments

Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints Ingestion-build-115288 Establishing a procurement systemDD IEC PAS 62137 3: 2009 describes the selection of an appropriate test method for reliability testing of solder joints. The test methods given are applicable to evaluate the strength of joints of a component mounted on printed wiring board, but not to test the mechanical strength of components themselves. The test conditions for accelerated tests (rapid temperature change and high temperature tests) may exceed the maximum allowable temperature range