99. 9% Density: 4. 506 g cm3 Melting Point: 1668C Size: 1" dia x 0. 5 mm Surface finish: One side polished < 30A by AFM within a 5x5 micron area Application: substrates for metal, alloy film, and biological materials Related Product Metallic Substrate A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> 99. 9% Density: 4. 506 g cm3 Melting Point: 1668C Size: 1" dia x 0. 5 mm Surface finish: One side polished < 30A by AFM within a 5x5 micron area Application: substrates for metal, alloy film, and biological materials Related Product Metallic Substrate A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> 99. 9% Density: 4. 506 g cm3 Melting Point: 1668C Size: 1" dia x 0. 5 mm Surface finish: One side polished < 30A by AFM within a 5x5 micron area Application: substrates for metal, alloy film, and biological materials Related Product Metallic Substrate A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> Titanium (Ti) Metallic Substrate: 1"x0.5 mm, 1side polished - mcTi25D05C1 Fe(SS-Poly) One Sample Retrieval Rod made – wnoz-abocard.de

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Titanium (Ti) Metallic Substrate: 1"x0.5 mm, 1side polished - mcTi25D05C1 Fe(SS-Poly) One Sample Retrieval Rod made

$161.00

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Description

One Sample Retrieval Rod made of Steel

and one of the advantage from water-based (Aqueous) chemistry is it isn't prone to catching fire

For advanced control over gas flow

Crystal structure: Orthorhombic

Resistivity:>10000 ohm-CM

Titanium (Ti) Metallic Substrate: 1"x0.5 mm, 1side polished - mcTi25D05C1 Fe(SS-Poly) One Sample Retrieval Rod madePolycrystal Ti metallic substrate Purity: > 99. 9% Density: 4. 506 g cm3 Melting Point: 1668C Size: 1" dia x 0. 5 mm Surface finish: One side polished < 30A by AFM within a 5x5 micron area Application: substrates for metal, alloy film, and biological materials Related Product Metallic Substrate A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater

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