G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Revision:Default Title No information is provided concerning

No information is provided concerning the diameter of the wafer at points other than those measured

本安全ガイドラインは，Environmental Health & Safety Global Technical Committeeで技術的に承認されている。現版は2015年1月5日，global Audits and Reviews Subcommitteeにて承認された。2015年5月にwww

SEMI M54-0319 (technical revision)

This guide is intended for use in abatement selection for both gaseous and particulate contaminant materials potentially emitted from semiconductor manufacturing facilities

and incoming or outgoing inspection

G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Revision:Default Title No information is provided concerningThis document is prepared to enable standard measurement techniques to be used. It is intended that the measurement techniques described in the specification will apply to all molded plastic package tooling (i. e., DIPS, SIPS, PCC, SO, Quad, and TAB). Referenced SEMI Standards SEMI G14 Plastic Molded DIP Tooling SEMI G16 Plastic Chip Carrier Tooling SEMI G36 Plastic Molded High Density TAB Quad Tooling SEMI G37 Plastic Molded SO Package Tooling