P00600 - SEMI P6 - フォトマスク用レジストレーションマーク StdTpc-Lead Finishes For a knowledge of the

For a knowledge of the strength determining factors (such as fatigue and stress corrosion) of wafer bonding

use of this method for commercial transactions is not recommended unless the parties to the test establish the degree of correlation that can be obtained

6-0703 (Reapproved 0218)

and Safety Guideline for FPD Manufacturing Systems

This Standard defines the materials

P00600 - SEMI P6 - フォトマスク用レジストレーションマーク StdTpc-Lead Finishes For a knowledge of theNOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. SEMI SEMI global Micropatterning Committee2007425global Audits and Reviews Subcommittee20076www. semi. org1988 NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met.