C09900 - SEMI C99 - Test Method for Determining Conductivity of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals StdPbc-0309 1-0310 (technical revision)

1-0310 (technical revision)

· セラミックベース上のはんだガラス中に取り付けられたリードフレームと，同様のガラス封止層を持つキャップ

2  Chemical reagents may include acids

メンテナンスあるいはサービスに必要なあらゆる装置が含まれる。

Characteristic parameters of these defects are part of wafer specifications (SEMI PV22)

C09900 - SEMI C99 - Test Method for Determining Conductivity of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals StdPbc-0309 1-0310 (technical revision)This Test Method provides a standardized test method for measuring and reporting the conductivity of slurries and post chemical mechanical polish (CMP) chemicals. This Test Method defines the number of significant digits to which conductivity will be reported, given the limitations of current metrology and methodology capabilities, and define a standardized temperature for the measurement. This Test Method also supplies a method of calibrating