Leadframe and Substrate Package Assembly Process StdPbc-211 and SEMI E137

and SEMI E137

SEMI E30-0611 (technical revision)

SEMI MF1366-0308 (technical revision)

SemI D67-0819 (technical revision)

本スタンダードは，global Metrics Technical Committeeで技術的に承認されている。現版は2012年8月30日，global Audits and Reviews Subcommitteeにて発行が承認された。2012年9月にwww

Leadframe and Substrate Package Assembly Process StdPbc-211 and SEMI E137Course Description This course provides an overview of the leadframe and substrate package assembly processes. It provides an overview of the leadframe and substrate material before diving into the package assembly processes. The assembly processes of QFP leadframe and flip chip BGA package from wire bond, die attach, and flip chip to package singulation will be shared in this course. Course Objectives Identify the materials in the leadframe and rigid