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G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding StdPbc-1119 org in July 2006

$193.00

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org in July 2006

SEMI E119 — Mechanical Specification for Reduced-Pitch Front-Opening Box for Interfactory Transport of 300 mm Wafers

and behavior identified in these Standards

1-0312 (technical revision)

This flange is to be mounted to the floor within the volume defined by the equipment loadport standards

G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding StdPbc-1119 org in July 2006This Standard defines the pull strength test method for wire bonding. Referenced SEMI Standards None.

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