C09800 - SEMI C98 - Guide for Chemical Mechanical Planarization (CMP) Particle Size Distribution (PSD) Measurement and Reporting Used in Semiconductor Manufacturing StdPbc-0094 SEMI E1 — Specification for

SEMI E1 — Specification for 3 inch

SEMI MF728-1106 (Reapproved 0317)

SEMI M58-1109 (Reapproved 0125)

· オプションA: 能動搬送（能動OHSなど）で内部ストッカーのロードポートに水平にFOUPを移載する。図1にオプションAを示す。

The damage is revealed by a preferential etch that removes silicon in the region of the deformation

C09800 - SEMI C98 - Guide for Chemical Mechanical Planarization (CMP) Particle Size Distribution (PSD) Measurement and Reporting Used in Semiconductor Manufacturing StdPbc-0094 SEMI E1 — Specification forThe purpose of this Document is to provide a guide for the measurement of and reporting of particle size distributions (PSD) for chemical mechanical planarization (CMP) slurries. Most CMP slurries have a wide range of particle sizes from a few nanometers to several hundreds of nanometers. This Guide does not define which measurement technique should be used but focuses on the parameters to report on a Certificate of Analysis (CoA) and on the roadmap