A00200 - SEMI A2 - Specification for Surface Mount Assembler Smart Hookup (SMASH) Revision:SEMI A2-1019 - Superseded 향상된 캐리어(carrier) 핸드오프(handoff) 병렬 I/O

향상된 캐리어(carrier) 핸드오프(handoff) 병렬 I/O 인터페이스는 능동 장비를 사용하여 수동 장비에서 주고 받는 캐리어(carrier)의 핸드오프(handoff)를 컨트롤(controls)한다

This Document defines three orthogonal reference planes as references for carrier dimensions

The purpose of this Document is to define the test method used to characterize the susceptibility of semiconductor processing

1e12-1e13 C atoms/cm2

In the case of 150 mm wafers

A00200 - SEMI A2 - Specification for Surface Mount Assembler Smart Hookup (SMASH) Revision:SEMI A2-1019 - Superseded 향상된 캐리어(carrier) 핸드오프(handoff) 병렬 I/OThe purpose of this Standard is to provide a standardized automation interface specification to be used for the equipment control in an assembly line for printed circuit board (PCB) that uses surface mount technology (SMT). The purpose of this Standard is to provide an interface specification that replaces conventional electrical interface with a network connection and adds data communication capability. The scope of this Standard is to define an