E11600 - SEMI E116 - Specification for Equipment Performance Tracking Revision:SEMI E116-0518 - Superseded bonding wires

bonding wires

It is intended to establish a common basis for developing detailed specifications for design

full wafers are basically used

) diagonal

overcoat layer

E11600 - SEMI E116 - Specification for Equipment Performance Tracking Revision:SEMI E116-0518 - Superseded bonding wiresThis Standard provides specification for implementing basic equipment performance tracking (EPT) for production equipment. Provisions in this Standard enable the host computer to track basic equipment performance in an automated and consistent matter, without operator or host input. This Standard provides specification for equipment suppliers to: Track basic equipment states (no operator or host input required). Track basic equipment states in a