G09800 - SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G98-1122 - Current 8 — Guide for High

8 — Guide for High Purity and Ultrahigh Purity Gas Distribution Systems in Semiconductor Manufacturing Equipment

Chips and scratches can be origins for crack generation

and thickness of the gold plating shall be specified per MIL-G-45204 unless otherwise agreed between vendor and customer

本スタンダードは，global Liquid Chemicals Technical Committeeで技術的に承認されている。現版は2012年6月18日，global Audits and Reviews Subcommitteeにて発行が承認された。2012年8月にwww

SEMI 3D5 — Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures

G09800 - SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G98-1122 - Current 8 — Guide for HighMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of