3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications StdPbc-0721 These specifications cover substrate requirements

These specifications cover substrate requirements for monocrystalline high-purity silicon carbide wafers of crystallographic polytype 6H and 4H used in semiconductor and electronic device manufacturing

this Test Method only applies if the laser is Class 1 or Class 2

1-0211 (Reapproved 0623) — Specification for Round 50 mm Diameter Polished Monocrystalline Indium Phosphide Wafers

本ガイドラインに概説した手順を実行することは，ガスもしくは制御用ガスのモニタと制御に使われ，潜在的に危険なマスフローデバイスを，輸送および/もしくは受入れ時に関係したリスクを，減らすためのテクニックを与える。

Ambiguities and uncertainties regarding surface defects may be resolved by reference to this Guide

3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications StdPbc-0721 These specifications cover substrate requirementsThe purpose of this Specification is to establish basic physical dimensions for the glass carrier intended to be used for panel level package processing. This Specification specifies physical dimensions of the glass carrier for use in panel level packaging (PLP) applications.<br><br>This Specification describes glass carrier with 510 mm 515 mm and 600 mm 600 mm panel sizes as specified by the relevant SEMI 3D20. Referenced SEMI Standards (purchase